FSRM course "Wafer Bonding"

Posted by TINC on February 28, 2012 at 8:53pm

Here is a course to learn the properties and the potential of various wafer bonding processes regarding their applicability to the fabrication of MEMS devices :

Wafer Bonding

March 29-30, 2012	in Didcot, Oxford (England)
Registration deadline:	Wednesday, March 14

To see the course description and to register, please click on the link above.

course

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