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FSRM course "Wafer Bonding"

Here is a course to learn the properties and the potential of various wafer bonding processes regarding their applicability to the fabrication of MEMS devices :

Wafer Bonding

March 29-30, 2012 in Didcot, Oxford (England)
Registration deadline: Wednesday, March 14


To see the course description and to register, please click on the link above.

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