FSRM course "Wafer Bonding"

Posted by TINC on May 10, 2011 at 10:33pm
Here is a course to learn the properties and the potential of various wafer bonding processes regarding their applicability to the fabrication of MEMS devices :

Wafer Bonding

June 16, 2011

in Zurich

Registration deadline:

Wednesday, June 1


To see the course description and to register, please click on the link above.

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