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Market competitions force the engineers to design electronic devices more powerful but importantly smaller in size. Such smaller size electronic devices face the problem of heat generated from the process cycle, thus experience poor reliability. Efficient thermal interface materials that are able to remove heat from electronic devices have been in great demand.

For more on this hot issue and the role of nanofibers in it, please go to http://www.nafigate.com/en/section/portal/app/news/detail/70468-aligned-nanofibers-cool-down-hot-electronic-devices

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