Numerical studies of infiltration dynamics of liquid- copper and silicon/solid- carbon system

3439928453?profile=original

K. Iqbal1*J.J. Sha1Zhen-kun Lei2, AMaqsood2, MMujahid3

 1State Key Laboratory of Structural Analyses for Industrial Equipment, School of Aeronautics and Astronautics, Dalian University of Technology, 116024 Dalian, China

                                  2State Key Laboratory of Structural Analyses for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, 116024 Dalian, China

3Department of Physics, Air University, Islamabad , Pakistan

                                          4School of Chemical and Materials Engineering, National University of Sciences and Technology, Islamabad, Pakistan

Mathematical modelling of infiltration dynamics of liquid Cu-Si alloy into porous carbon is presented. Two-dimensional infiltration equations are developed using the Washburn equation in the limit of both interface and diffusion control, for situations where the capillary radius decreases either linear or parabolic, and the contact angles are assumed to exponentially decrease with time during infiltration. One major manufacturing process for the Cu-Si/C composites is liquid melt infiltration (LMI). This article focuses on non-equilibrium wetting effects and offers, a fundamental approach to these complex kinetic phenomena.

JOM, 6, 953-959

Links to the paper: http://link.springer.com/article/10.1007%2Fs11837-014-0951-x

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