The Laboratory of Thermodynamics in Emerging Technologies (LTNT) at ETH Zurich has an opening for a
Post-doctoral research scientist
Topic: Nanocomposites for thermally conductive underfills in electronic chip packaging.
The successful candidate will be involved in a collaborative project with IBM Research – Zurich. The project aims to address high end packing needs in fabrication of microprocessors consisting of 3D chip stacks, which are expected to dominate the next generation of IT industry. The success of 3D chip stacks depends critically on thermal management. Our interest lies in investigating thermo-mechanical characterization of novel nanocomposites manufactured from particle suspensions, which could serve as thermal underfill materials in future chip stacks. The candidate will help develop, analyze and characterize the dielectric, thermally conducting, self-assembled nanocomposites. The work is primarily experimental in nature with an additional theoretical part to explain the experimental observations. We plan to look into both the thermal as well as the mechanical behavior of the nanocomposites, using a broad range of microscopy methods common in materals science, as well by developing specific methods for the thermal characterization.