Failure Analysis Engineer - 718604
Description
Job Description:
This is an entry level position for a technical college graduate. As a Failure Analysis Engineer you will be part of our Technology Development and Manufacturing Labs responsible for locating yield and reliability limiting failures on SRAM test vehicles and leading product chips for Intel's next generation Silicon, Assembly or Test Process Development and Manufacturing. The candidate must work in concert with Integration, Yield, Device and Quality & Reliability Engineers to enable robust failure rate models and risk assessments of the silicon/assembly processes under development to improve process performance, product yield, quality and/or reliability. The scope may include wafer and unit level Front-end Module, Back-End/Far Back-End Modules, Package Assembly, or Environmental Stress/Test capability.
Your responsibilities will include but are not be limited to:
· Utilizing lab equipment's such as Dual Beam Electron microscope, polishers, dimplers, dry and wet etchers to prepare samples for failure analysis, electrical probing and TEM analysis
· Utilizing modern techniques in fault isolation such as IREM, LADA, nano-probing and TIVA to locate fails quickly and reliably
· Developing new sample preparation techniques and electrical probing techniques for future generation device failure analysis.
· Authoring failure analysis reports and identifying root causes.
· Supporting new process/product transfer and startup and the automation and improvement of the failure analysis process.
· Collaborating with integration, device, and yield Engineers to assist in risk assessments.
Qualifications
Qualifications
You must possess the below minimum qualifications to be consider for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience can be obtained through a combination of prior education, current M.S. course work, projects, research and any relevant prior job/internships.
Minimum Qualifications:
M.S. degree in Electrical Engineering, Physics, Materials Science or related discipline.
Preferred Qualifications:
· Demonstrated strong knowledge of device physics, and materials analysis
· Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.
· Prior Intel Intern or Scholarship recipient
· Hands-on experience with lab equipment, including microscopy tools, such as SEM, DIB, TEM, AFM, or nano-prober, oscilloscopes, semiconductor parameter analyzers
· Semiconductor device fabrication and characterization knowledge and experience
· Knowledge and experience in functional testers, IREM, LADA, or TIVA are plus
Job Category: Engineering
Primary Location: USA-Oregon, Hillsboro
Full/Part Time: Full Time
Job Type: College Graduate
Regular/Temporary: Regular
Posting Date: Sep 24, 2013
Apply Before
: Sep 24, 2014
Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
Posting Statement: Intel does not discriminate based on race, color, religion, gender, national origin, age, disability, protected veteran status or any other characteristic protected by local law, regulation, or ordinance. More info at WWW.INTEL.COM/JOBS.
Description
Job Description:
This is an entry level position for a technical college graduate. As a Failure Analysis Engineer you will be part of our Technology Development and Manufacturing Labs responsible for locating yield and reliability limiting failures on SRAM test vehicles and leading product chips for Intel's next generation Silicon, Assembly or Test Process Development and Manufacturing. The candidate must work in concert with Integration, Yield, Device and Quality & Reliability Engineers to enable robust failure rate models and risk assessments of the silicon/assembly processes under development to improve process performance, product yield, quality and/or reliability. The scope may include wafer and unit level Front-end Module, Back-End/Far Back-End Modules, Package Assembly, or Environmental Stress/Test capability.
Your responsibilities will include but are not be limited to:
· Utilizing lab equipment's such as Dual Beam Electron microscope, polishers, dimplers, dry and wet etchers to prepare samples for failure analysis, electrical probing and TEM analysis
· Utilizing modern techniques in fault isolation such as IREM, LADA, nano-probing and TIVA to locate fails quickly and reliably
· Developing new sample preparation techniques and electrical probing techniques for future generation device failure analysis.
· Authoring failure analysis reports and identifying root causes.
· Supporting new process/product transfer and startup and the automation and improvement of the failure analysis process.
· Collaborating with integration, device, and yield Engineers to assist in risk assessments.
Qualifications
Qualifications
You must possess the below minimum qualifications to be consider for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience can be obtained through a combination of prior education, current M.S. course work, projects, research and any relevant prior job/internships.
Minimum Qualifications:
M.S. degree in Electrical Engineering, Physics, Materials Science or related discipline.
Preferred Qualifications:
· Demonstrated strong knowledge of device physics, and materials analysis
· Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.
· Prior Intel Intern or Scholarship recipient
· Hands-on experience with lab equipment, including microscopy tools, such as SEM, DIB, TEM, AFM, or nano-prober, oscilloscopes, semiconductor parameter analyzers
· Semiconductor device fabrication and characterization knowledge and experience
· Knowledge and experience in functional testers, IREM, LADA, or TIVA are plus
Job Category: Engineering
Primary Location: USA-Oregon, Hillsboro
Full/Part Time: Full Time
Job Type: College Graduate
Regular/Temporary: Regular
Posting Date: Sep 24, 2013
Apply Before
: Sep 24, 2014
Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
Posting Statement: Intel does not discriminate based on race, color, religion, gender, national origin, age, disability, protected veteran status or any other characteristic protected by local law, regulation, or ordinance. More info at WWW.INTEL.COM/JOBS.
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