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Course Title | DATE | WHERE |
Wafer Bonding | 29-30.03.2012 | AML at Didcot near Oxford, England |
Non-silicon materials for microsystem technologies: Properties, shaping and applications - NEW! | 16.04.2012 | KIT Karlsruhe, Germany |
Polymer Microfabrication (2 days) | 17-18.04.2012 | Karlsruhe, Germany |
Electron Microscopy: recent progress in methodologies and new applications | 11.05.2012 | Neuchâtel, Switzerland |
Labs-on-Chip Technologies: Basics and Applications | 22-23.05.2012 | Barcelona, Spain |
Electromagnetic Compatibility of Integrated Circuits | 01.06.2012 | Neuchâtel, Switzerland |
RF MEMS and NEMS | 19.06.2012 | Lausanne, Switzerland |
Microsystems in Biomedical Engineering and Medical Products | 25-26.06.2012 | Neuchâtel, Switzerland |
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