Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist and spin coatable hard mask materials to transfer the resist patterns. Spin coatable materials permit users of tSPL to reduce time and cost of the patterning process.
Added by INS Finland on February 27, 2018 at 10:53am — No Comments
Added by INS Finland on February 26, 2018 at 10:22am — No Comments