"Spicy world of NanoScience" since 2007
Here is a course to learn the properties and the potential of various wafer bonding processes regarding their applicability to the fabrication of MEMS devices :
|March 29-30, 2012||in Didcot, Oxford (England)|
|Registration deadline:||Wednesday, March 14|
To see the course description and to register, please click on the link above.