WE ARE STILL ACCEPTING NEW PAPER TITLES

 

(item 1) we are still accepting NEW paper titles  for ICCE-19 Shanghai, China.  All areas of Composite materials, metals, polymers, ceramics, or nano materials will be welcomed, among other current topics such as chemistry materials,  biology, natural fibers, environmental and energy materials, infrastructure roads and bridges, computational materials and experimental mechanics, among other..   Please inform interested professors, researchers, especially students, and junior faculty members, who need visibilities to present papers. 

 

Interested authors should submit NEW paper titles now or as soon as possible,  and then submit detailed two page short papers by June 1, 2011 (time extension  possible)  to David Hui, each page has two-column format, and short papers must have  as many results as possible.    

 

You are invited to develop a session(s) or symposium, if interested, please inform me.

 

(item 2) the ICCE-19 registration fee of US$390 before May 24, 2011, is reasonable for five day conference in the financial capital city of Asia , Shanghai, and student registration fee of US$200 is even more reasonable.

 

 

(item 3) All these ICCE-19 detailed two-page short papers  are peered reviewed and will appear as short papers in World Journal of Engineering (WJOE), upon payment of registration fee and attendance of ICCE-19.   Further, “all” full-length version of these short papers (with paper title change) will also be peered reviewed and published in selected SCI journals.   Thus, all participants will have two journal papers as a benefit of coming to ICCE-19 Shanghai, China.   I am serving as editorial board members of approximately 10 SCI journals.

 

There is no need for full-length paper, but we highly encourage submission of full-length papers, please do so during or immediately after the conference.

 

 

(item 4) The excellent five-star affordable hotel venue in Shanghai, will be announced very soon.

 

 

David Hui

Chair ICCE-19 Shanghai, China

dhui@uno.edu

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